IP Library Patent Application 18940325
Patent Application Utility
App. No. 18/940,325 · Confirmation No. 7495

HIGH BANDWIDTH BONDED ASSEMBLY WITH THROUGH-SUBSTRATE VIA STRUCTURES SHIELDED BY GUARD RINGS AND METHODS FOR FORMING THE SAME

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Quick Facts
App. No.
18/940,325
Filed
2024-11-07
Pub. No.
US20260130282A1
Art Unit
OPAP