Patent Assignment
Reel/Frame 069286/0267
Assignment of Assignor's Interest
Recorded: 2024-10-31
Pages: 15
Assignors
GLARIS, PATRICE
Executed: 2023-07-25
YEAP, YEAN-WEI
Executed: 2023-09-14
THIENARD, OLIVIER
Executed: 2023-09-13
MOUSQUE, VALERIE
Executed: 2023-09-14
Assignee
LINXENS HOLDING
37 RUE DES CLOSEAUX, MANTES-LA-JOLIE, 78200, FRANCE
Covered Property
(1)
Method for Manufacturing Chip Card Modules and Band of Flexible Material Supporting Such Modules