Patent Assignment
Reel/Frame 069543/0364
Assignment of Assignor's Interest
Recorded: 2024-12-10
Pages: 3
Assignor
LIN, SHIAU-SHI
Executed: 2024-08-01
Assignee
DIODES INCORPORATED
4949 HEDGCOXE ROAD, SUITE 200, PLANO, TEXAS, 75024
Covered Property
(1)
Electronic Component Package and Manufacuring Method Thereof