Patent Assignment
Reel/Frame 069646/0959
Assignment of Assignor's Interest
Recorded: 2024-12-20
Pages: 8
Assignors
SATO, KITARU
Executed: 2024-01-04
SAKAI, TAKAAKI
Executed: 2024-11-01
FURUYA, KENJI
Executed: 2024-11-01
MAEDA, HIDEYUKI
Executed: 2024-10-30
KODAIRA, HIROSHI
Executed: 2024-10-31
Assignees
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
LG INNOTEK CO., LTD.
30, MAGOKJUNGANG 10-RO, GANGSEO-GU, SEOUL, 07796, KOREA, REPUBLIC OF
Covered Property
(1)
Bismaleimide Composition, Cured Product, Sheet, Laminated Body, and Flexible Printed Wiring Board
Application:
18/569,894 →
Publication:
US 2024/0278536
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.