Patent Assignment
Reel/Frame 069734/0144
Assignment of Assignor's Interest
Recorded: 2025-01-03
Pages: 3
Assignor
LU, CHAO-CHUN
Executed: 2024-12-27
Assignee
INVENTION AND COLLABORATION LABORATORY, INC.
10 F., NO. 22, LN. 35, JIHU RD., NEIHU DIST., TAIPEI CITY, 114754, TAIWAN
Covered Property
(1)
Semiconductor Circuit Structure with Direct Die Heat Removal Structure