Patent Assignment
Reel/Frame 069834/0057
Assignment of Assignor's Interest
Recorded: 2025-01-13
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Substrate Having Multiple Build-Up Parts
Application:
18/626,395 →
Publication:
US 2024/0339393