Patent Assignment
Reel/Frame 069845/0273
Assignment of Assignor's Interest
Recorded: 2025-01-13
Pages: 6
Assignors
CARNEY, FRANCIS J.
Executed: 2016-07-25
HALL, JEFFERSON W.
Executed: 2016-07-25
SEDDON, MICHAEL J.
Executed: 2016-07-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, ATTN: IP LEGAL DEPT, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Semiconductor Device and Method of Forming Micro Interconnect Structures
Application:
19/019,071 →
Publication:
US 2025/0149425