Patent Assignment
Reel/Frame 070067/0030
Assignment of Assignor's Interest
Recorded: 2025-01-30
Pages: 6
Assignors
OLSON, TIMOTHY L.
Executed: 2023-02-03
BISHOP, CRAIG
Executed: 2023-02-03
DAVIS, ROBIN
Executed: 2023-02-10
HOFFMAN, PAUL R.
Executed: 2022-12-23
Assignee
DECA TECHNOLOGIES USA, INC.
7855 SOUTH RIVER PARKWAY, STE. 205, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Assembly Comprising a 3D Block and Method of Making the Same