IP Library Assignment 070193/0268
Patent Assignment
Reel/Frame 070193/0268

Assignment of Assignor's Interest

Recorded: 2025-02-12 Pages: 8
Assignors
HODUL, JOHN N.
Executed: 2025-01-31
WEMP, CLAIRE K.
Executed: 2025-02-11
Assignee
LAIRD TECHNOLOGIES, INC.
16401 SWINGLEY RIDGE ROAD, SUITE 700, CHESTERFIELD, MISSOURI, 63017
Covered Property (1)
Controlling Bond Line Thickness (BLT) For Metal Amalgams
Application: 19/051,389 →
Publication: US 2025/0259966
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 7, 2025
From: HODUL, JOHN N.; WEMP, CLAIRE K.; STRADER, JASON L.
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 070443/0001 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →