Patent Assignment
Reel/Frame 070246/0686
Assignment of Assignor's Interest
Recorded: 2025-02-18
Pages: 3
Assignors
YANG, TZU-HSIEN
Executed: 2021-07-06
NOGUCHI, HIROKI
Executed: 2021-07-06
FUJIWARA, HIDEHIRO
Executed: 2021-07-09
WANG, YIH
Executed: 2021-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Vertical Interconnect Structures in Three-Dimensional Integrated Circuits