Patent Assignment
Reel/Frame 070338/0827
Assignment of Assignor's Interest
Recorded: 2025-02-26
Pages: 3
Assignor
UZOH, CYPRIAN EMEKA
Executed: 2016-05-17
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
Application:
18/828,400 →
Publication:
US 2024/0429100
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 1, 2024
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 069051/0741 →
Assignment of Assignor's Interest
Oct 1, 2024
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 068750/0266 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →
Change of Name
Feb 26, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 070343/0468 →
Change of Name
Feb 26, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 070343/0515 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →