IP Library › Assignment 070471/0949
Patent Assignment
Reel/Frame 070471/0949

Assignment of Assignor's Interest

Recorded: 2025-03-11 Pages: 3
Assignors
DELACRUZ, JAVIER A.
Executed: 2021-01-29
HABA, BELGACEM
Executed: 2021-01-29
KO, JUNG
Executed: 2021-02-03
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Circuitry for Electrical Redundancy in Bonded Structures
Application: 18/339,964 →
Publication: US 2023/0395544
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 11, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 070479/0872 →