Circuitry for electrical redundancy in bonded structures
View Patent ↗A bonded structure is disclosed. The bonded structure can include a first element that has a first plurality of contact pads. The first plurality of contact pads includes a first contact pad and a second redundant contact pad. The bonded structure can also include a second element directly bonded to the first element without an intervening adhesive. The second element has a second plurality of contact pads. The second plurality of contact pads includes a third contact pad and a fourth redundant contact pad. The first contact pad is configured to connect to the third contact pad. The second contact pad is configured to connect to the fourth contact pad. The bonded structure can include circuitry that has a first state in which an electrical signal is transferred to the first contact pad and a second state in which the electrical signal is transferred to the second contact pad.
1. A bonded structure comprising:
a first element having a first plurality of contact pads at a first surface, the first plurality of contact pads including a first contact pad and a second contact pad spaced apart from one another along the first surface;
a second element hybrid bonded to the first element without an intervening adhesive, the second element having a second plurality of contact pads at a second surface, the second plurality of contact pads including a third contact pad and a fourth contact pad spaced apart from one another along the second surface, wherein the first contact pad is disposed opposite to the third contact pad, and wherein the second contact pad is disposed opposite to the fourth contact pad; and
switching circuitry for selectively transferring an electrical signal either through the first and third contact pads or through the second and fourth contact pads, thereby providing redundant connections between the first and second elements.
2. The bonded structure of claim 1 , wherein the switching circuitry comprises at least a first portion disposed in the first element, the circuitry having a first state in which the electrical signal is transferred to the first contact pad and a second state in which the electrical signal is transferred to the second contact pad.
3. The bonded structure of claim 1 , wherein the switching circuitry comprises a second portion disposed in the second element, the second portion having a first state in which the electrical signal is transferred to the third contact pad and a second state in which the electrical signal is transferred to the fourth contact pad.
4. The bonded structure of claim 3 , wherein the switching circuitry forms at least a portion of a bidirectional tri-stated interconnect structure.
5. The bonded structure of claim 4 , wherein:
the first portion of the switching circuitry comprises a first receive flip-flop and a first transmit flip-flop, an output line of the first transmit flip-flop electrically connected to an input line of the first receive flip-flop and to the second contact pad, the input line of the first receive flip-flop connected to the first contact pad; and
the second portion of the switching circuitry comprises a second receive flip-flop and a second transmit flip-flop, an output line of the second transmit flip-flop electrically connected to an input line of the second receive flip-flop and to the fourth contact pad, the input line of the first receive flip-flop connected to the third contact pad.
6. The bonded structure of claim 3 , wherein:
the first portion of the switching circuitry comprises a multiplexer (MUX) or demultiplexer (DEMUX) electrically connected to a first flip-flop, and wherein the MUX or DEMUX selectively transfers the electrical signal to the first contact pad or the second contact pad; and
the second portion of the switching circuitry comprises a second flip-flop in the second element, the MUX or DEMUX selectively transferring the electrical signal to the second flip-flop along a first path through the first contact pad or along a second path through the second contact pad.
7. The bonded structure of claim 3 , wherein the first portion of the switching circuitry comprises an AND gate configured to selectively transfer the electrical signal to the first contact pad or the second contact pad.
8. The bonded structure of claim 3 , wherein the first portion of the switching circuitry comprises a first plurality of multiplexers (MUX) electrically connected to a first flip-flop in the first element, wherein a first MUX of the first plurality of MUX transfers the electrical signal to the first contact pad.
9. The bonded structure of claim 8 , wherein the first MUX receives the electrical signal from the first flip-flop or a second electrical signal from a second flip-flop in the first element, and a second MUX of the first plurality of MUX receives the electrical signal from the first flip-flop and transfers the electrical signal to the second contact pad.
10. The bonded structure of claim 1 , wherein a void is disposed between at least a portion of the first and third contact pads, and wherein the second and fourth contact pads physically and electrically contact one another.
11. The bonded structure of claim 10 , wherein the first and third contact pads are not directly electrically connected to one another.
12. The bonded structure of claim 1 , wherein the first and second contact pads are spaced apart by at least 50 microns.
13. The bonded structure of claim 1 , wherein the first and second contact pads are spaced apart by at least twice a pitch of the first plurality of contact pads.
14. A bonded structure comprising:
a first element having a first plurality of operational contact pads and a second plurality of redundant contact pads at a bonding interface, wherein the first plurality of operational contact pads includes more contact pads than the second plurality of redundant contact pads;
a second element hybrid bonded to the first element without an intervening adhesive, the second element having a third plurality of operational contact pads and a fourth plurality of redundant contact pads at the bonding interface, wherein the first plurality of operational contact pads are disposed opposite to the third plurality of operational contact pads, and wherein the second plurality of redundant contact pads are disposed opposite to the fourth plurality of redundant contact pads; and
switching circuitry for selectively transferring one or more electrical signals from selected pads from the first plurality of operational pads to selected pads from the second plurality of redundant pads, wherein each pad of the second plurality of redundant pads can be selectively connected to any one of multiple pads of the first plurality of operational pads.
15. The bonded structure of claim 14 , wherein a ratio of the first plurality to the second plurality and of the third plurality to the fourth plurality is in a range of 2:1 to 15:1.
16. The bonded structure of claim 15 , wherein a ratio of the first plurality to the second plurality and of the third plurality to the fourth plurality is in a range of 5:1 to 10:1.
17. The bonded structure of claim 14 , wherein the first plurality of operational contact pads comprise signal pads.
18. The bonded structure of claim 14 , wherein each of the first and second elements further comprise corresponding ground and power pads, further comprising passively connected redundant pads for the ground and power pads.
19. The bonded structure of claim 14 , wherein each pad of the first plurality of first operational contact pads is spaced from each pad of the second plurality of redundant contact pads by at least 10 microns.
20. The bonded structure of claim 14 , wherein the switching circuitry has transferred an electrical signal from a first operational pad of the first plurality of first operational contact pads to a second redundant pad of the second plurality of redundant contact pads, wherein the first operational pad is spaced from the second redundant pad by at least 50 microns.
21. The bonded structure of claim 14 , wherein each pad of the first plurality of operational pads can be selectively connected to any one of multiple pads of the second plurality of redundant pads.
22. The bonded structure of claim 21 , wherein each pad of the first plurality of operational pads can be selectively connected to any one of the second plurality of redundant pads.
23. The bonded structure of claim 14 , wherein each pad of the second plurality of redundant pads can be selectively connected to any one of 2-15 pads of the first plurality of operational pads.