Electrical redundancy for bonded structures
View Patent ↗An element that is configured to bond to another element is disclosed. A first element that can include a first plurality of contact pads on a first surface. The first plurality of contact pads includes a first contact pad and a second contact pad that are spaced apart from one another. The first and second contact pads are electrically connected to one another for redundancy. The first element can be prepared for direct bonding. The first element can be bonded to a second element to form a bonded structure. The second element has a second plurality of contact pads on a second surface. At least one of the second plurality of contact pads is bonded and electrically connected to at least one of the first plurality of contact pads.
1. A first element configured to directly bond to a second element without an intervening adhesive, the first element comprising:
a first plurality of contacts at a first surface of the first element, the first plurality of contacts including a first contact, a second contact, and a third contact between the first and second contacts, the first plurality of contacts prepared for direct bonding;
a conductive line electrically connecting the first and second contacts without an intervening switch such that the first and second contacts are electrically redundant; and
a first dielectric field region at the first surface of the first element, the first dielectric field region disposed at least partially between the first and second contacts, the first dielectric field region prepared for direct bonding,
wherein the third contact and the first contact are not electrically redundant.
2. The first element of claim 1 , wherein the first and second contacts are signal pads.
3. The first element of claim 2 , further comprising a power or ground contact without an electrically redundant contact therefor.
4. The first element of claim 1 , wherein the first and second contacts are power or ground pads.
5. The first element of claim 1 , wherein the first and second contacts spaced apart from one another by at least 10 microns.
6. The first element of claim 1 , wherein the first and second contacts are spaced apart from one another by a spacing that is in a range of two to 1000 times a pitch between the first and third contacts.
7. The first element of claim 1 , further comprising a fourth contact and a fifth contact spaced apart from one another by at least 10 microns, and a second conductive line electrically connecting the fourth and fifth contacts without an intervening switch, such that the fourth and fifth contacts are electrically redundant.
8. The first element of claim 7 , wherein the fourth and fifth contacts are signal pads.
9. The first element of claim 1 , further comprising a plurality of electrically non-redundant pads between the first and second contacts.
10. The first element of claim 1 , wherein the first to third contacts comprise contact pads.
11. A bonded structure comprising:
a first element having a first dielectric field region, a first signal contact, a second signal contact, the first and second signal contacts electrically shorted to one another; and
a second element stacked on the first element, the second element having a second dielectric field region directly bonded to the first dielectric field region, and a plurality of contacts, at least one of the plurality of contacts bonded and electrically connected to at least one of the first and second signal contacts.
12. The bonded structure of claim 11 , wherein the first element further comprises a third contact positioned between the first and second signal contacts, where the first and second signal contacts are not electrically shorted to the third contact.
13. The bonded structure of claim 12 , wherein the first element further comprises a power or ground contact without an electrically redundant contact therefor.
14. The bonded structure of claim 12 , wherein the first and second signal contacts are spaced apart by a spacing of at least 10 microns.
15. The bonded structure of claim 14 , wherein the spacing is in a range of 50 microns to 1500 microns.
16. A bonded structure comprising:
a first element having a first dielectric field region and a first set of contacts spaced apart from one another, the first set of contacts including a first contact, a second contact, and a third contact positioned between the first and second contacts, the second contact being electrically redundant with the first contact, the third contact being electrically non-redundant with the first contact; and
a second element stacked on the first element, the second element having a second dielectric field region directly bonded to the first dielectric field region and a second set of contacts spaced apart from one another, at least one of the second set of contacts directly bonded and electrically connected to at least one of the first set of contacts.
17. The bonded structure of claim 16 , wherein the first and second contacts are spaced apart by at least 10 microns.
18. The bonded structure of claim 17 , wherein the first and second contacts are spaced apart by 50 microns to 1500 microns.
19. The bonded structure of claim 16 , wherein the first and second contacts are signal pads.
20. The bonded structure of claim 16 , wherein the first and second contacts are power or ground pads.
21. The bonded structure of claim 16 , further comprising a circuit coupled between the first contact and the second contact, the circuit configured to selectively enable electrical shorting the first contact to the second contact.