IP Library › Assignment 064716/0001
Patent Assignment
Reel/Frame 064716/0001

Change of Name

Recorded: 2023-08-24 Pages: 5
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (4)
Interconnect Structures
Application: 18/451,366 →
Publication: US 2024/0047344
Bonded Structure with Interconnect Structure
Application: 18/451,388 →
Publication: US 2024/0234353
Tsv as Pad
Application: 18/451,674 →
Publication: US 2024/0088101
Electrical Redundancy for Bonded Structures
Application: 18/451,727 →
Publication: US 2023/0420419
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 24, 2023
From: UZOH, CYPRIAN EMEKA; FOUNTAIN, GAIUS GILLMAN, JR.; THEIL, JEREMY ALFRED
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064698/0018 →
Assignment of Assignor's Interest Aug 24, 2023
From: KATKAR, RAJESH; HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064698/0575 →
Assignment of Assignor's Interest Aug 24, 2023
From: GAO, GUILIAN; LEE, BONGSUB; FOUNTAIN, GAIUS GILLMAN, JR.; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064699/0004 →
Assignment of Assignor's Interest Aug 24, 2023
From: HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064697/0861 →