IP Library Assignment 064697/0861
Patent Assignment
Reel/Frame 064697/0861

Assignment of Assignor's Interest

Recorded: 2023-08-24 Pages: 3
Assignor
HABA, BELGACEM
Executed: 2021-04-06
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Bonded Structure with Interconnect Structure
Application: 18/451,388 →
Publication: US 2024/0234353
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 24, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 064716/0001 →