Patent Assignment
Reel/Frame 070485/0027
Assignment of Assignor's Interest
Recorded: 2025-03-12
Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties
(4)
Method of Manufacturing Semiconductor Device
Data Communication Method for Mobile Communication System
Three-Dimensionally Formed Circuit Sheet, Component and Method for Manufacturing the Same
Thermal Head and Manufacturing Method Thereof
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 9, 2004
From: KIM, HOE-WON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 014890/0364 →
Assignment of Assignor's Interest
Nov 8, 2004
From: SHOJI, KAZUNO
To: POLYMATECH, CO., LTD.
Reel/Frame 015981/0712 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 015981 Frame 0712. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jun 6, 2005
From: SHOJI, KAZUNO
To: POLYMATECH CO., LTD.
Reel/Frame 016099/0023 →
Assignment of Assignor's Interest
May 17, 2006
From: YOKOYAMA, SHINYA
To: ALPS ELECTRIC CO., LTD.
Reel/Frame 017888/0680 →
Change of Name
Apr 28, 2017
From: POLYMATECH CO., LTD.
To: POLYMA ASSET MANAGEMENT CO., LTD.
Reel/Frame 042372/0390 →
Assignment of Assignor's Interest
May 23, 2017
From: POLYMA ASSET MANAGEMENT CO., LTD.
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042479/0853 →
Change of Name
Jan 31, 2019
From: ALPS ELECTRIC CO., LTD.
To: ALPS ALPINE CO., LTD.
Reel/Frame 048794/0230 →