Patent Assignment
Reel/Frame 070524/0773
Assignment of Assignor's Interest
Recorded: 2025-03-16
Pages: 6
Assignors
LEE, NAEUN
Executed: 2025-02-19
JUNG, SHINHWA
Executed: 2025-02-19
LEE, SANGHEE
Executed: 2025-02-19
LEE, WONHEE
Executed: 2025-02-19
JANG, DONGHYUN
Executed: 2025-02-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Densifying Plasma-Resistant Coating Layer
Application:
19/076,124 →