Patent Assignment
Reel/Frame 070686/0689
Assignment of Assignor's Interest
Recorded: 2025-03-31
Pages: 8
Assignors
YOO, INPIL
Executed: 2022-06-02
TEYSSEYRE, JEROME
Executed: 2022-06-06
JEON, OSEOB
Executed: 2022-06-09
LEE, KEUNHYUK
Executed: 2022-06-07
SEDDON, MICHAEL J.
Executed: 2022-06-06
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, ATTN: IP LEGAL DEPT, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Dual Side Direct Cooling Semiconductor Package
Application:
19/096,220 →
Publication:
US 2025/0233050