Patent Assignment
Reel/Frame 070689/0567
Corrective Assignment to Correct the Misspelled Funia to Funai Previously Recorded on Reel 33754 Frame 588. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2025-03-31
Pages: 4
Assignor
LEXMARK INTERNATIONAL, INC.
Executed: 2014-05-28
Assignee
FUNAI ELECTRIC CO., LTD.
7-7-1, NAKAGAITO, DAITO-SHI, OSAKA, 5740013, JAPAN
Covered Property
(1)
Fluid Ejection Chip Including Hydrophilic and Hydrophopic Surfaces and Methods of Forming the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 12, 2014
From: GRAHAM, DAVID C.; RHINE, DAVID B.; WEAVER, SEAN T.; CRAFT, CHRISTOPHER A.
To: LEXMARK INTERNATIONAL, INC.
Reel/Frame 033092/0164 →
Assignment of Assignor's Interest
Sep 17, 2014
From: LEXMARK INTERNATIONAL, INC.
To: FUNIA ELECTRIC CO., LTD.
Reel/Frame 033754/0588 →
Patent Security Agreement
Aug 30, 2018
From: LEXMARK INTERNATIONAL, INC.
To: CHINA CITIC BANK CORPORATION LIMITED, GUANGZHOU BRANCH, AS COLLATERAL AGENT
Reel/Frame 046989/0396 →
Corrective Assignment to Correct the Incorrect U.S. Patent Number Previously Recorded at Reel: 046989 Frame: 0396. Assignor(S) Hereby Confirms the Patent Security Agreement.
Oct 24, 2018
From: LEXMARK INTERNATIONAL, INC.
To: CHINA CITIC BANK CORPORATION LIMITED, GUANGZHOU BRANCH, AS COLLATERAL AGENT
Reel/Frame 047760/0795 →
Release of Security Interest
Jan 18, 2024
From: CHINA CITIC BANK CORPORATION LIMITED, GUANGZHOU BRANCH, AS COLLATERAL AGENT
To: LEXMARK INTERNATIONAL, INC.
Reel/Frame 066345/0026 →
Assignment of Assignor's Interest
Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0313 →