IP Library Assignment 070797/0059
Patent Assignment
Reel/Frame 070797/0059

Assignment of Assignor's Interest

Recorded: 2025-04-10 Pages: 3
Assignors
BRIGGS, BENJAMIN D.
Executed: 2016-04-11
NOGAMI, TAKESHI
Executed: 2016-04-11
PATLOLLA, RAGHUVEER R.
Executed: 2016-04-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Semiconductor Interconnect Structure with Double Conductors
Application: 18/793,294 →
Publication: US 2024/0395702
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0448 →
Assignment of Assignor's Interest Apr 10, 2025
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 070797/0062 →
Change of Name Apr 10, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 070811/0275 →
Security Interest May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →