Patent Assignment
Reel/Frame 070946/0517
Assignment of Assignor's Interest
Recorded: 2025-04-25
Pages: 3
Assignors
GAO, GUILIAN
Executed: 2019-09-17
UZOH, CYPRIAN EMEKA
Executed: 2019-09-18
THEIL, JEREMY ALFRED
Executed: 2019-09-17
HABA, BELGACEM
Executed: 2019-09-23
KATKAR, RAJESH
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Molded Direct Bonded and Interconnected Stack
Application:
19/068,370 →
Publication:
US 2025/0246583
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 25, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 071059/0947 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →