Patent Assignment
Reel/Frame 071223/0691
Assignment of Assignor's Interest
Recorded: 2025-05-27
Pages: 7
Assignors
ZHANG, TONGLONG
Executed: 2025-05-27
ZHANG, XIAODONG
Executed: 2025-05-27
GUAN, YONG
Executed: 2023-06-26
WANG, SIMIN
Executed: 2022-08-16
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Chip Package on Package Structure, Packaging Method Thereof, and Electronic Device