Patent Assignment
Reel/Frame 071418/0125
Assignment of Assignor's Interest
Recorded: 2025-06-16
Pages: 4
Assignee
VOLANTIS SEMICONDUCTOR, INC.
15976 NW HECKMAN LANE, PORTLAND, OREGON, 97229
Covered Property
(1)
Cold Plate Cooling for Wafer-Scale Integration with Back Side Modular Power Delivery
Application:
18/958,107 →