IP Library Assignment 071550/0632
Patent Assignment
Reel/Frame 071550/0632

Assignment of Assignor's Interest

Recorded: 2025-06-27 Pages: 5
Assignors
IYER, SATYANARAYAN
Executed: 2023-10-23
STEED, TORRY
Executed: 2023-10-23
Assignee
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Property (1)
Memory Packaging with Integrated Active Cooling Devices and Related Methods
Application: 18/383,108 →
Publication: US 2025/0132290
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →