Patent Assignment
Reel/Frame 071566/0512
Confirmatory License
Recorded: 2025-06-30
Pages: 2
Assignor
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
Executed: 2025-06-23
Assignee
NNSA
24600 20TH ST SE, ALBUQUERQUE, NEW MEXICO, 87117
Covered Property
(1)
Multi-Die Semiconductor Wafer Using Silicon Wafer Substrate Embedment
Patent:
12,532,791 →
Application:
19/186,366 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.