Patent Assignment
Reel/Frame 071766/0775
Assignment of Assignor's Interest
Recorded: 2025-07-20
Pages: 3
Assignor
CHANG, JEN-YUAN
Executed: 2022-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Die Assembly Having a Polygonal Linking Die