Patent Assignment
Reel/Frame 072170/0807
Assignment of Assignor's Interest
Recorded: 2025-09-05
Pages: 6
Assignors
LEE, SANGJAE
Executed: 2020-07-21
KIM, JAEHYUNG
Executed: 2020-07-21
EUN, DONGSEOG
Executed: 2020-07-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Devices Having Stacked Structures Therein That Support High Integration
Application:
18/333,886 →
Publication:
US 2023/0328990