Patent Assignment
Reel/Frame 072210/0942
Assignment of Assignor's Interest
Recorded: 2025-09-10
Pages: 8
Assignors
YOO, INPIL
Executed: 2021-01-22
ESTACIO, MARIA CRISTINA
Executed: 2021-01-25
TEYSSEYRE, JEROME
Executed: 2021-01-26
IM, SEUNGWON
Executed: 2021-01-28
EOM, JOOYANG
Executed: 2021-01-26
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, ATTN: IP LEGAL DEPT, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Semiconductor Packages Using Package in Package Systems and Related Methods
Application:
19/323,829 →
Publication:
US 2026/0011683