Patent Assignment
Reel/Frame 072255/0195
Change of Name
Recorded: 2025-07-29
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Post Cmp Processing for Hybrid Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2019
From: FOUNTAIN, GAIUS GILLMAN, JR.; GAO, GUILIAN; MANDALAPU, CHANDRASEKHAR
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051081/0070 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →