Patent Assignment
Reel/Frame 072260/0732
Assignment of Assignor's Interest
Recorded: 2025-09-15
Pages: 4
Assignees
ND-HI TECHNOLOGIES LAB, INC.
2F-2, NO. 22, LN. 35, JIHU RD., NEIHU DIST.,, TAIPEI CITY, 114754, TAIWAN
ETRON TECHNOLOGY, INC.
NO. 6, TECHNOLOGY ROAD 5, HSINCHU SCIENCE PARK, HSINCHU COUNTY, TAIWAN
Covered Property
(1)
Semiconductor Package and Semiconductor Package Assembly with Edge Interconnection and Method of Forming the Same
Application:
19/059,275 →
Publication:
US 2025/0233045