Patent Assignment
Reel/Frame 072567/0917
Assignment of Assignor's Interest
Recorded: 2025-10-14
Pages: 6
Assignors
TSENG, HSIN-HSIANG
Executed: 2025-10-13
YEH, CHI-RUEI
Executed: 2020-10-23
CHIANG, TSUNG-YU
Executed: 2020-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier Layer for Contact Structures of Semiconductor Devices