IP Library Assignment 072604/0105
Patent Assignment
Reel/Frame 072604/0105

Assignment of Assignor's Interest

Recorded: 2025-10-20 Pages: 2
Assignor
ENQUIST, PAUL M.
Executed: 2015-07-14
Assignee
ZIPTRONIX, INC.
5400 GLENWOOD AVE., SUITE G-05, RALEIGH, NORTH CAROLINA, 27612
Covered Property (1)
Conductive Barrier Direct Hybrid Bonding
Application: 16/383,455 →
Publication: US 2019/0237419
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Jul 26, 2022
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 060927/0115 →
Change of Name Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0507 →