IP Library › Assignment 073173/0507
Patent Assignment
Reel/Frame 073173/0507

Change of Name

Recorded: 2025-10-20 Pages: 5
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (9)
Bonded Structures
Application: 15/979,312 →
Publication: US 2018/0337157
Conductive Barrier Direct Hybrid Bonding
Application: 16/383,455 →
Publication: US 2019/0237419
Increased Contact Alignment Tolerance for Direct Bonding
Application: 16/388,692 →
Publication: US 2019/0244899
Interface Structures and Methods for Forming Same
Application: 16/600,227 →
Publication: US 2020/0043848
Seal for Microelectronic Assembly
Application: 16/678,037 →
Publication: US 2020/0140267
Seal for Microelectronic Assembly
Application: 16/678,058 →
Publication: US 2020/0140268
Bonded Structures
Application: 16/723,877 →
Publication: US 2020/0144217
Bonded Structures
Application: 16/724,017 →
Publication: US 2020/0126945
Processing Stacked Substrates
Application: 16/921,110 →
Publication: US 2020/0388503
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Sep 22, 2020
From: UZOH, CYPRIAN EMEKA; GAO, GUILIAN
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 053848/0702 →
Change of Name Jul 26, 2022
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 060927/0115 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Oct 20, 2025
From: WANG, LIANG; KATKAR, RAJESH; DELACRUZ, JAVIER A.; SITARAM, ARKALGUD R.
To: ZIPTRONIX, INC.
Reel/Frame 072605/0832 →
Assignment of Assignor's Interest Oct 20, 2025
From: KATKAR, RAJESH; WANG, LIANG; UZOH, CYPRIAN EMEKA; HUANG, SHAOWU
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 072606/0249 →
Assignment of Assignor's Interest Oct 20, 2025
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 072604/0105 →
Assignment of Assignor's Interest Oct 20, 2025
From: KATKAR, RAJESH; WANG, LIANG; UZOH, CYPRIAN EMEKA; HUANG, SHAOWU
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 072606/0659 →
Assignment of Assignor's Interest Oct 20, 2025
From: ENQUIST, PAUL; WANG, LIANG; KATKAR, RAJESH; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 072606/0665 →
Assignment of Assignor's Interest Oct 20, 2025
From: UZOH, CYPRIAN EMEKA; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 072606/0583 →
Assignment of Assignor's Interest Oct 20, 2025
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.; DELACRUZ, JAVIER A.
To: ZIPTRONIX, INC.
Reel/Frame 072604/0359 →
Assignment of Assignor's Interest Oct 20, 2025
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 072604/0790 →
Assignment of Assignor's Interest Oct 20, 2025
From: WANG, LIANG; KATKAR, RAJESH; DELACRUZ, JAVIER A.; SITARAM, ARKALGUD R.
To: ZIPTRONIX, INC.
Reel/Frame 072605/0600 →