IP Library › Assignment 072669/0530
Patent Assignment
Reel/Frame 072669/0530

Assignment of Assignor's Interest

Recorded: 2025-10-24 Pages: 6
Assignor
FLASHSILICON INCORPORATION
Executed: 2025-10-16
Assignee
GIANT CHIP INTEGRATED CIRCUIT CHIP (HEFEI) CO., LTD.
9/F POWERCHINA HUADONG R&D BUILDING, NO. 868 XI'AN ROAD, BAOHE DISTRICT, HEFEI, ANHUI, CHINA
Covered Properties (10)
Scalable Gate Logic Non-Volatile Memory Cells and Arrays
Patent: 9,048,137 →
Application: 13/399,753 →
Publication: US 2013/0214341
Complementary Electrical Erasable Programmable Read Only Memory
Patent: 8,817,546 →
Application: 13/454,871 →
Publication: US 2013/0279266
3-D Single Floating Gate Non-Volatile Memory Device
Patent: 8,716,803 →
Application: 13/644,880 →
Publication: US 2014/0097483
Interconnection Matrix Using Semiconductor Non-Volatile Memory
Patent: 8,879,323 →
Application: 13/683,721 →
Publication: US 2014/0140139
Multiple-Time Configurable Non-Volatile Look-Up-Table
Patent: 8,988,104 →
Application: 13/778,784 →
Publication: US 2014/0239999
Digital Perceptron
Patent: 9,754,668 →
Application: 15/059,733 →
Publication: US 2017/0256296
Configurable Non-Volatile Content Addressable Memory
Patent: 9,595,330 →
Application: 15/283,802 →
Publication: US 2017/0025175
Standby Current Reduction in Digital Circuitries
Application: 15/405,747 →
Publication: US 2018/0205368
Mosfet Threshold Voltage Sensing Scheme for Non-Volatile Memory
Application: 15/822,804 →
Methods of Erasing Semiconductor Non-Volatile Memories
Application: 17/514,401 →
Publication: US 2022/0052065
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 17, 2012
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 027726/0507 →
Assignment of Assignor's Interest Apr 24, 2012
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 028100/0001 →
Assignment of Assignor's Interest Oct 4, 2012
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 029079/0483 →
Assignment of Assignor's Interest Nov 21, 2012
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 029339/0437 →
Assignment of Assignor's Interest Feb 28, 2013
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 029898/0916 →
Assignment of Assignor's Interest Mar 10, 2016
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 037949/0675 →
Assignment of Assignor's Interest Jan 31, 2017
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 041134/0476 →
Assignment of Assignor's Interest Nov 28, 2017
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 044233/0315 →
Assignment of Assignor's Interest Nov 4, 2019
From: FLASHSILICON INCORPORATION
To: LEWAY INTEGRATED CIRCUIT (HONG KONG) LIMITED
Reel/Frame 050906/0719 →
Assignment of Assignor's Interest Nov 8, 2021
From: WANG, LEE
To: FLASHSILICON INCORPORATION
Reel/Frame 058042/0563 →
Assignment of Assignor's Interest Dec 20, 2021
From: LEWAY INTEGRATED CIRCUIT (HONG KONG) LIMITED
To: FLASHSILICON INCORPORATION
Reel/Frame 058426/0553 →
Assignment of Assignor's Interest Mar 24, 2026
From: GIANT CHIP INTEGRATED CIRCUIT (HEFEI) CO., LTD.
To: HEFEI GIANT CHIP INTELLIGENT TECHNOLOGY CO., LTD.
Reel/Frame 074163/0963 →
Assignment of Assignor's Interest Apr 29, 2026
From: HEFEI GIANT CHIP INTELLIGENT TECHNOLOGY CO., LTD.
To: FLASHSILICON INCORPORATION
Reel/Frame 074513/0962 →