Patent Assignment
Reel/Frame 072675/0928
Assignment of Assignor's Interest
Recorded: 2025-10-26
Pages: 3
Assignee
ICOMETRUE COMPANY LTD.
18F.-3, NO.32, GAOTIE 2ND RD., HSINCHU COUNTY, 302, TAIWAN
Covered Property
(1)
3D Chip Package Based on Through-Silicon-via Interconnection Elevator
Application:
18/129,840 →
Publication:
US 2023/0343689