Patent Assignment
Reel/Frame 072819/0443
Assignment of Assignor's Interest
Recorded: 2025-11-07
Pages: 4
Assignor
HU, DYI-CHUNG
Executed: 2025-10-20
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 179, SHANYING RD., GUISHAN DIST., TAOYUAN CITY, 333, TAIWAN
Covered Properties
(6)
Substrate Components for Packaging Ic Chips and Electronic Device Packages of the Same
High Density Film for Ic Package
"Bonding Film for Signal Communication Between Central Chip and Peripheral Chips and Fabricating Method Thereof"
Bonding Film
Package Structure Having Embedded Bonding Film and Manufacturing Method Thereof
Substrate Structure and Electronic Device Having Coarse Redistribution Layer Electrically Connected to Fine Redistribution Layer