Patent Assignment
Reel/Frame 072865/0853
Assignment of Assignor's Interest
Recorded: 2025-11-12
Received: 2025-11-12
Pages: 4
Assignors
FU, LI
Executed: 2025-11-05
HAU, KA WAH
Executed: 2025-11-05
KWOK, CHI HO
Executed: 2025-11-05
LAM, CHIN HO
Executed: 2025-11-05
LEE, KA I
Executed: 2025-11-05
WANG, YANHUI
Executed: 2025-11-05
WANG, YUECHEN
Executed: 2025-11-05
Assignee
NANO AND ADVANCEDMATERIALS INSTITUTE LIMITED
UNITS 515-517, 5/F, LAKESIDE 1, NO. 8 SCIENCEPARK WEST AVENUE, HONG KONG SCIENCEPARK, SHATIN, NEW TERRITORIES, HONG KONG, HKX, HONG KONG
Covered Property
(1)
Oxidation Resistant Copper Die-Bonding Material for Metal Joining in Semiconductor Devices
Application:
19/386,238 →