IP Library › Patent Application 19386238
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App. No. 19/386,238 · Confirmation No. 8245

OXIDATION RESISTANT COPPER DIE-BONDING MATERIAL FOR METAL JOINING IN SEMICONDUCTOR DEVICES

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Quick Facts
App. No.
19/386,238
Filed
2025-11-12
Pub. No.
US20260131405A1
Art Unit
OPAP