IP Library › Patent Application 63720150
Patent Application Provisional Small
App. No. 63/720,150 · Confirmation No. 5959

OXIDATION RESISTANT COPPER DIE-BONDING PASTE FOR PRESSURE ASSISTED METAL JOINING IN SEMICONDUCTOR DEVICES

Provisional Application Expired
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2024-11-20 APP.FILE.REC Filing Receipt 3 View
2024-11-20 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2024-11-13 SPEC Specification — View
2024-11-13 APPENDIX Appendix to the specification 16 View
2024-11-13 N417 Electronic Filing System Acknowledgment Receipt 3 View
2024-11-13 DRW.NONBW Drawings-other than black and white line drawings 4 View
2024-11-13 N417.PYMT Electronic Fee Payment 2 View
2024-11-13 ADS Application Data Sheet 10 View
2024-11-13 TR.PROV Provisional Cover Sheet (SB16) 4 View
2024-11-13 SPEC Specification 17 View
2024-11-13 CLM Claims 3 View
2024-11-13 ABST Abstract 1 View
2024-11-13 APPENDIX.SUPP Appendix to the specification — View
2024-11-13 DRW.SUPP Drawings-black and white line and/or other drawings — View
2024-11-13 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2024-11-13 APPENDIX Appendix to the specification 1 View
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Quick Facts
App. No.
63/720,150
Filed
2024-11-13