Patent Assignment
Reel/Frame 072981/0619
Assignment of Assignor's Interest
Recorded: 2025-11-20
Pages: 8
Assignors
LEGENDRE, OLIVIER
Executed: 2018-06-28
BORE, FRANÇOIS
Executed: 2025-05-14
DERVAUX, BENOIT
Executed: 2025-05-15
Assignee
TELEDYNE E2V SEMICONDUCTORS SAS
AVENUE DE ROCHEPLEINE, SAINT EGREVE, 38120, FRANCE
Covered Property
(1)
Flip-Chip Ball Grid Array-Type Integrated Circuit Package for Very High Frequency Operation
Application:
17/750,122 →
Publication:
US 2022/0375885