Patent Assignment
Reel/Frame 073035/0817
Assignment of Assignor's Interest
Recorded: 2025-11-25
Pages: 3
Assignor
LU, CHAO-CHUN
Executed: 2025-11-05
Assignee
INVENTION AND COLLABORATION LABORATORY, INC.
10 F., NO. 22, LN. 35, JIHU RD., NEIHU DIST., TAIPEI CITY, 114754, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Efficient Heat-Removal Structures Across the Chip and Monolithic Fabrication Method Therefor
Application:
18/533,720 →
Publication:
US 2025/0125211