Patent Assignment
Reel/Frame 073061/0567
CHANGE OF NAME
Recorded: 2025-10-13
Received: 2025-10-13
Pages: 3
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, SINGAPORE
Covered Applications
(4)
Semiconductor Device and Method of Forming Flipchip Interconnection Structure with Bump on Partial Pad
App. No. 12/969,451
→
METHOD OF FORMING PARTIALLY-ETCHED CONDUCTIVE LAYER RECESSED WITHIN SUBSTRATE FOR BONDING TO SEMICONDUCTOR DIE
App. No. 12/951,399
→
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App. No. 12/786,008
→
PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
App. No. 12/131,038
→