IP Library Assignment 073074/0886
Patent Assignment
Reel/Frame 073074/0886

Merger

Recorded: 2025-12-02 Pages: 17
Assignor
SHINKAWA LTD.
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property (1)
Apparatus for Producing Semiconductor Device, and Method for Producing Semiconductor Device
Application: 17/609,401 →
Publication: US 2022/0223450
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2021
From: SEYAMA, KOHEI; TAKAHASHI, MAKOTO
To: SHINKAWA LTD.
Reel/Frame 058053/0431 →