Patent Assignment
Reel/Frame 073669/0477
Merger and Change of Name
Recorded: 2026-02-03
Pages: 8
Assignors
RENESAS ELECTRONICS AMERICA INC.
Executed: 2019-12-10
INTEGRATED DEVICE TECHNOLOGY, INC.
Executed: 2019-12-10
Assignee
RENESAS ELECTRONICS AMERICA INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Properties
(2)
Semiconductor Resonators with Electromagnetic and Environmental Shielding and Methods of Forming Same
Patent:
8,164,159 →
Application:
12/838,158 →
Crystal Oscillator Fabrication Methods Using Dual-Deposition of Mounting Cement and Dual-Curing Techniques
Patent:
9,445,536 →
Application:
14/586,534 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 4, 2010
From: ARMSTRONG, WILLIAM EDDIE; MCCORQUODALE, MICHAEL SHANNON; GUPTA, VIDYABHUSAN; O'DAY, JUSTIN
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 025315/0928 →
Assignment of Assignor's Interest
Jan 2, 2015
From: GUBSER, ROBERT A.; GHAI, AJAY KUMAR; PATEL, VIRESH PIYUSH
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 034611/0588 →
Security Agreement
Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest
Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →