Patent Assignment
Reel/Frame 073791/0711
Assignment of Assignor's Interest
Recorded: 2026-02-14
Pages: 4
Assignors
ZHANG, CHONG
Executed: 2023-10-25
LU, HAIWEI
Executed: 2023-10-31
GROOTHUIS, STEVE
Executed: 2023-10-31
Assignee
AYAR LABS, INC.
3351 OLCOTT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(2)
Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
Application:
63/516,834 →
Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
Application:
18/486,088 →
Publication:
US 2025/0044534