Patent Assignment
Reel/Frame 074334/0462
Assignment of Assignor's Interest
Recorded: 2026-04-10
Pages: 4
Assignors
CHEN, KAOCHAO
Executed: 2022-11-01
HO, CHIA-CHENG
Executed: 2022-11-01
LEE, CHIA-JUI
Executed: 2022-11-01
WEI, CHIA-YU
Executed: 2022-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Methods of Formation
Application:
19/642,032 →
Publication:
US US20260231484A1