Patent Assignment
Reel/Frame 074527/0414
Assignment of Assignor's Interest
Recorded: 2026-04-30
Pages: 3
Assignors
HUANG, CHING-YU
Executed: 2023-03-08
TING, KUO-CHIANG
Executed: 2023-02-28
KO, TING-CHU
Executed: 2023-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Manufacturing 3DIC Package Comprising a Plurality of Discrete Device Dies Bonding to a Wafer
Application:
18/151,609 →
Publication:
US 2024/0072034