Patent Assignment
Reel/Frame 074936/0361
Assignment of Assignor's Interest
Recorded: 2026-06-12
Pages: 3
Assignee
THE UNIVERSITY OF HONG KONG
POKFULAM ROAD, HONG KONG, CHINA
Covered Property
(1)
Cu-Cu Direct Welding for Packaging Application in Semiconductor Industry
Application:
18/267,492 →
Publication:
US 2023/0411347