Patent Assignment
Reel/Frame 075126/0506
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2026-03-19
Received: 2026-03-19
Pages: 41
Assignor
NXP USA, INC.
Executed: 2026-02-02
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
39, CHEMIN DU CHAMP-DES-FILLES, PLAN-LES-OUATES, GENEVA, CHX, 1228, SWITZERLAND
Covered Applications
(10)
COMPENSATION AND CALIBRATION OF MULTIPLE MASS MEMS SENSOR
App. No. 15/705,307
→
MICROELECTROMECHANICAL DEVICE AND A METHOD OF DAMPING A MASS THEREOF
App. No. 15/453,306
→
MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME
App. No. 15/448,801
→
PRESSURE SENSOR WITH VARIABLE SENSE GAP
App. No. 14/931,557
→
DIFFERENTIAL CAPACITIVE OUTPUT PRESSURE SENSOR AND METHOD
App. No. 14/854,648
→
COMPENSATION AND CALIBRATION OF MULTIPLE MASS MEMS SENSOR
App. No. 14/844,965
→
MULTI-AXIS INERTIAL SENSOR WITH DUAL MASS AND INTEGRATED DAMPING STRUCTURE
App. No. 14/805,105
→
MEMS DEVICE WITH COMMON MODE REJECTION STRUCTURE
App. No. 14/744,693
→
MULTI-SENSOR SYSTEM AND METHOD OF FORMING SAME
App. No. 14/700,424
→
METHOD OF MAKING A MEMS DIE HAVING A MEMS DEVICE ON A SUSPENDED STRUCTURE
App. No. 14/658,598
→